交付項目:
BLE SoC Architecture and System Design • Advanced RF transceiver architecture for low cost, low power and high performance • Optimized digital baseband algorithms for enhanced data throughput • System and modules specifications definition BLE Modules IP • Initial version of modules IP design in terms of circuit schematic, source code, netlist and simulation • Initial version modules including RF transceiver, digital baseband, control and interface logic, analog and digital peripherals etc • Refined modules IP design in terms of circuit schematic, source code, netlist and simulation • Refined modules including RF transceiver, digital baseband, control and interface logic, analog and digital peripherals etc • Protocol stack design including C codes and RTL codes BLE SoC • Initial version of BLE 4.2 SoC engineering samples • Refined version of BLE 4.2 SoC engineering samples Reference Design • Reference design for BLE 4.2 SoC to function and test in a platform
描述:
低功耗蓝牙（BLE）是促进物联网应用（IoT）的关键技术之一。根据MarketsandMarkets 的市场研究，BLE装置的出货量有望可以於2020年超过12亿。於2014年12月发佈的低功耗蓝牙4.2 标準是一项重大的更新。其关键技术包括低功耗、低成本、改善的数据吞吐量、连接性和安全性。 在这个项目中，我们会开发低功耗蓝牙 4.2 版本的系统芯片（SoC）。我们将在射频收发器，数字基带，协议栈及其他IP 模块的设计上采用创新关键技术，以达到目标性能。我们将会开发先进的射频收发器架构，例如直接调制发射器和I/Q 在射频接收通路实现的接收器，以及采用优化的数字基带算法，以达到最佳的功耗、成本和性能。我们会开发所有新的功能，例如开发协议栈中的IPv6和低功耗安全连接以改善连接性和安全性。我们计划了两次流片来开发矽验證的系统芯片, 同时提供参考设计, 并展示低功耗蓝牙4.2的新功能。 此项目将提供完整的知识产权组合和芯片方案，并集成了协议栈来支援最新的低功耗蓝牙4.2标準。我们将藉此项目推进香港和中国大陆地区的无线技术能力, 帮助本地的芯片设计公司，无线方案供应商，OEM和ODM製造厂商创造竞争优势。
