交付项目:
By the end of this full project, the following documents/process recipes/product prototypes will be delivered:
- A polymer-based via-isolation manufacturing process including via formation, via isolation and via filling for TSV-based applications;
- Technical reports on TSV-based CIS products, including development trends, market status and potential applications;
- A low-resolution (e.g., VGA with 0.3Mp) CIS product prototype with at least 20% cost reduction vs. the state-of-art design using TSV-based 3D packaging technologies;
- At least 4 patents filed;
- A high-resolution (e.g., 5Mp) CIS product prototype with at least 20% cost reduction vs. the state-of-art design using TSV-based 3D packaging technologies.
描述:
在過去四十多年裏，摩爾定律一直推動著半導體工業的發展。但是，為了開發新的更小尺寸、更多功能、及更好可靠性的電子產品，近年來摩爾定律面臨越來越多的技術挑戰 開發更小尺度的製造技術和集成不同功能的積體電路。近來，三維封裝被提出作為一種關鍵技術來解決上述的問題。本項目將開發並建立三維晶園級封裝技術平臺，包括設計、工藝、和測試等；進而，將應用相關技術開發低成本的CMOS圖像感測器。本專案的成果主要包括兩種(一個低解析度，一個高解析度) 低成本圖像感測器樣品。本項目不僅可以通過建立三維晶園級封裝能力把香港和中國的微電子封裝工業水準提昇到世界水平﹐而且還可以通過開發高性能和低成本的新型電子產品來增強微電子封裝工業的競爭力。
