Wireless Sensor Network Signal Processing Platform | ASTRI - Hong Kong Applied Science And Technology Research Institute Company Limited

Project Title:

Wireless Sensor Network Signal Processing Platform

Project Reference:

ART/133CP

Project Type:

Project Period:

20120401 - 20131231

Funds Approved (HK$’000):

13350

Project Coordinator:

Mr David Kwong

Deputy Project Coordinator:

Deliverable:

1. 0.18um Analog Front End (AFE) IP block consists of a programmable gain amplifier, a bandgap reference, a 12 bit resolutions DAC and a 8-channel 12-bit resolution ADC. 2. A 0.18um wireless sensor signal processing SoC with the Analog Front End together with a ARM Cortex M0 RISC processor. 3. 0.13um Analog Front End (AFE) IP block consists of a programmable gain amplifier, a bandgap reference, a 12 bit resolutions DAC and a 8-channel 14-bit resolution ADC. 4. A 0.13um wireless sensor signal processing SoC with the Analog Front End together with a ARM Cortex M0 RISC processor. 5. PCB demo module of e-health application (based on 0.13um wireless sensor signal processing SoC) to enable licensees to develop WSN products 6. PCB demo module of green energy application (based on 0.13um wireless sensor signal processing SoC) to enable licensees to develop WSN products 7. Full design documentation and application notes for end users.

Research Group:

Sponsor:

Description:

A wireless sensor network (WSN) signal processing platform is proposed here to handle various sensors interfaces for e-health and energy monitoring applications. The platform consists of a high precision, low power Analog Front End (AFE) block; a high performance digital signal processor with interface to an external wireless Radio Frequency Transceiver, such as Bluetooth or ZigBee RFIC.

Co-Applicant:

Keywords:

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Hong Kong Applied Science and Technology Research Institute (ASTRI) was founded by the Government of the Hong Kong Special Administrative Region in 2000 with the mission of enhancing Hong Kong’s competitiveness through applied research. ASTRI’s core R&D competence in various areas is grouped under five Technology Divisions: Advanced Electronic Components and Systems; Artificial Intelligence and Trust Technologies; Communications Technologies; Innovative Mind; and IoT Sensing and AI Technologies. It is applied across six core areas which are Smart City, Financial Technologies, New Industrialisation and Intelligent Manufacturing, Digital Health, Application Specific Integrated Circuits and Metaverse.

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