New Electrodeposition Materials For 3D-Interconnect Of High Density Substrate | ASTRI - Hong Kong Applied Science And Technology Research Institute Company Limited

Project Title:

New Electrodeposition Materials for 3D-Interconnect of High Density Substrate

Project Reference:

ARD/119

Project Type:

Project Period:

20130301 - 20130831

Funds Approved (HK$’000):

1950

Project Coordinator:

Dr Xunqing Daniel Shi

Deputy Project Coordinator:

Deliverable:

Research Group:

Dr Enboa Wu Dr Bin XIE Dr Yaofeng SUN Dr Min GAO Mr Yat Kit TSUI Dr Dan YANG Mr Shu Kin YAU Mr Minghui Gao

Sponsor:

Description:

Co-Applicant:

Keywords:

More about ASTRI

Hong Kong Applied Science and Technology Research Institute (ASTRI) was founded by the Government of the Hong Kong Special Administrative Region in 2000 with the mission of enhancing Hong Kong’s competitiveness through applied research. ASTRI’s core R&D competence in various areas is grouped under five Technology Divisions: Advanced Electronic Components and Systems; Artificial Intelligence and Trust Technologies; Communications Technologies; Innovative Mind; and IoT Sensing and AI Technologies. It is applied across six core areas which are Smart City, Financial Technologies, New Industrialisation and Intelligent Manufacturing, Digital Health, Application Specific Integrated Circuits and Metaverse.

Over the years, ASTRI has nurtured a pool of research, I&T talents and received numerous international awards for its pioneering innovations as well as outstanding business and community contributions. As of 2023/24, ASTRI has transferred more than 1,500 technologies to the industry and has been granted over 1,100 patents in the Mainland, the US, and other countries.

As a Hong Kong R&D centre, one of ASTRI’s important goals is to help customers harness business opportunities from the thriving technology market and increase their competitive strengths. Customers and partners can improve their efficacy by drawing on ASTRI’s expertise and research achievements.