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3D Metrology Technologies for Cross-platform Applications (ART/308CP)

Project Title:
3D Metrology Technologies for Cross-platform Applications (ART/308CP)
Project Reference:
ART/308CP
Project Type:
Platform
Project Period:
30 / 09 / 2020 - 31 / 03 / 2022
Funds Approved (HK$’000):
10,340.8
Project Coordinator:
Dr Xue Yan TANG
Deputy Project Coordinator:
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Deliverable:
Research Group:
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Sponsor:

UNRE AI Limited (CS) (Sponsor)
UNRE AI Limited (TL) (Sponsor)
MOTIC HONG KONG LIMITED (CS) (Sponsor)
MOTIC HONG KONG LIMITED (TL) (Sponsor)

Description:

3D machine vision market is becoming one of the top markets that has attracted a lot of attention in recent years. 3D vision has significant advantages over 2D system in providing 3D information on 3D physical spaces including 3D metrology for factory automation lines, building construction sites and automation design plant. World-class machine vision companies put much effort in 3D machine vision R&D. However, there are still challenges. 1. Most available products offer offline measuring solutions, which cannot meet fast measuring demand from many user scenarios. 2. There are no mature embedded 3D metrology solutions in the market to meet the requests from some verticals such as building construction. 3. High price of 3D metrology system offered by world-class companies restrains the market. If the price drops, the affordable price can drive the market. The R&D team’s objective is to develop a generic software platform for real-time and cross-platform 3D metrology technologies. The enabling technologies will provide solutions to the verticals including building construction, microscope and industry. The to-be-developed 3D metrology software technologies would solve the bottleneck of processing speed and the speed-accuracy balancing issue. The technologies are leading in providing real-time embedded solutions for various verticals. The technologies would ultimately benefit domestic 3D hardware companies in facilitating them to increase competence and gain more market share.

Co-Applicant:
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Keywords:
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